21.5″ Android panel PC — reference project
21.5″ Android Panel PC
Completed Portrait-format reference build: 3 mm bezel PCAP all-in-one with RK3399, Android 7.1 / 8.1, FHD 1920 × 1080, 4 GB + 128 GB standard, IP65 front / IP40 back, fanless aluminum front / metal back, VESA 100 × 100, Wi-Fi antennas.
- 250 cd/m² panel; 10-point PCAP with full lamination bonding.
- Operating −20 °C ~ 60 °C; storage −30 °C ~ 70 °C.
- HDMI, USB 2.0 / 3.0, RJ45, COM, audio, mini SIM; DC 12 V (≤ 60 W).
Highlights
- Industrial-grade LCD, continuous 24/7 operation
- Durable mechanical design for harsh environments
- PCAP: wet touch & glove touch
- Optical bonding available as a custom option
- Portrait chassis with side mounting tabs and rear antenna provision
- Wide-temperature design, high reliability
- IP65 front / IP40 back · fanless · Wi-Fi / Bluetooth · AG glass (Mohs 7)
Typical applications
- Portrait digital signage and elevator / wayfinding displays
- Fanless Android HMI with cellular SIM and Wi-Fi antennas
- Industrial panels with sealed IP65 front and metal rear enclosure
- Custom Android builds on RK3399 with 4 GB / 128 GB storage
Specifications
Values below match koretouch-sti-215ctpcw-android-rer-specifications.pdf (same edition as the downloadable file in Documents). *Additional custom specifications available on request.
LCD panel
| Screen size | 21.5″ |
|---|---|
| IP rating | IP65 (front) / IP40 (back) |
| Active area (H × V) | 477.6 mm × 269.1 mm |
| Pixel pitch | 0.24795 mm × 0.24795 mm (102 PPI) |
| Resolution | 1920 (RGB) × 1080 FHD, 16:9 |
| Color | 16.7M |
| Brightness | 250 cd/m² |
| Contrast ratio | 3000:1 (typ., TM) |
| Response time (Tr+Tf, typ.) | 18 ms (typ.) |
| Viewing angles (CR=10, typ.) | 85° / 85° / 85° / 85° (typ.) |
| Backlight / lifetime | WLED / 30,000 h |
Touch panel
| Touch screen | PCAP multi-touch (10 points), EETI |
|---|---|
| Touch interface | USB |
| Touch accuracy | ±2 mm |
| Tempered glass | Yes (AG coating) |
| Glass thickness | 3 mm |
PC system
| Motherboard | Industrial mainboard |
|---|---|
| CPU | RK3399 (Dual Core A72 + Quad Core A53), 1.8 GHz |
| Memory | DDR3 4 GB |
| Storage | eMMC 128 GB |
| Network | 10/100/1000 Mbit Ethernet · 2.4G Wi-Fi (802.11b/g/n) · Bluetooth 4.0 |
| Operating system | Android 7.1 / 8.1 |
External connectors
| External connectors | 1× audio (3.5 mm) · 1× HDMI · 1× USB 2.0 · 2× USB 3.0 · 1× RJ45 · 1× mini SIM · 1× DC 12 V · 1× COM |
|---|
Power
| Power supply | External power adapter |
|---|---|
| Power input | DC 12 V |
| Rated output current | 10 A |
| Output power | ≤ 60 W |
Operation & mechanical
| Overall dimensions (W × H × T) | 323.5 × 532.0 × 53.5 mm (per dimensional drawing) |
|---|---|
| Operating temperature | −20°C ~ 60°C |
| Storage temperature | −30°C ~ 70°C |
| Relative humidity | 10% ~ 90% RH (non-condensing) |
| Fanless design | Yes |
| Housing | Aluminum front and metal back |
| VESA / panel mounting | 100 × 100 |
| Warranty | 1 year |
Outline & drawing
Portrait envelope per dimensional drawing: 323.5 × 532.0 × 53.5 mm (W × H × T), VESA 100 × 100, side mounting tabs, and rear antenna provision. Front bezel about 1.7 mm; main chassis depth about 20 mm; rear electronics enclosure about 21.7 mm. Use the drawing for tolerances, cutouts, and production approval.
Envelope
323.5 × 532.0 × 53.5 mm
Active + mounting
Active: 477.6 × 269.1 mm · VESA 100 × 100
