13.3″ Android panel PC — reference project
13.3″ Android Panel PC
Completed Freestyle reference build: 3 mm bezel PCAP all-in-one with RK3399, Android 9.0, FHD 1920 × 1080, fully laminated touch stack, integrated camera and ID+IC dual-frequency card reader, IP65 front panel, aluminum housing, VESA 80 × 80.
- 250 cd/m² panel; 10-point PCAP with full lamination bonding.
- Operating 0 °C ~ 50 °C; storage −20 °C ~ 70 °C.
- RJ45, RS485+power combo port, up to 6× RS232 (1× RS485 optional); DC 12 V (≤ 18 W).
Highlights
- Industrial-grade LCD, continuous 24/7 operation
- Durable mechanical design for harsh environments
- PCAP: wet touch & glove touch
- Full lamination bonding (touch + LCM)
- Industrial camera — face recognition capable (per program)
- Wide-temperature design, high reliability
- IP65 front panel · integrated Wi-Fi · ID+IC card reader (MF/FS50/S70, TK4100, EM)
Typical applications
- Retail / hospitality kiosk with camera-based identification
- Access control and membership terminals (ID + IC card reader)
- Compact Freestyle fascia with wide top bezel for peripherals
- Programs requiring serial expansion and customized Android builds
Specifications
Values below match koretouch-sti-133ctpcw-android-freestyle-specifications.pdf (same edition as the downloadable file in Documents). *Additional custom specifications available on request.
LCD panel
| Screen size | 13.3″ |
|---|---|
| IP rating | IP65 (front) |
| Active area (H × V) | 293.76 mm × 165.24 mm |
| Pixel pitch | 0.15285 mm × 0.15285 mm (166 PPI) |
| Resolution | 1920 (RGB) × 1080 FHD, 16:9 |
| Color | 16.7M |
| Brightness | 250 cd/m² |
| Contrast ratio | 3000:1 (typ., TM) |
| Response time (Tr+Tf, typ.) | 18 ms (typ.) |
| Viewing angles (CR=10, typ.) | 85° / 85° / 85° / 85° (typ.) |
| Backlight / lifetime | WLED / 30,000 h |
Touch panel
| Touch screen | PCAP multi-touch (10 points), EETI |
|---|---|
| Touch interface | USB |
| Touch accuracy | ±2 mm |
| Tempered glass | Yes |
| Glass thickness | 1.1 mm |
PC system
| Motherboard | Industrial mainboard |
|---|---|
| CPU | RK3399 (Dual Core A72 + Quad Core A53), 1.8 GHz |
| Memory | DDR3 4 GB |
| Storage | eMMC 32 GB (standard) |
| Network | 10/100/1000 Mbit Ethernet · 2.4G Wi-Fi (802.11b/g/n) · Bluetooth 4.0 |
| Operating system | Android 9.0 |
External connectors
| External connectors | 1× RJ45 · 1× 2-in-1 RS485 + power port · Up to 6× RS232 (1× RS485 optional) |
|---|
Power
| Power supply | External power adapter |
|---|---|
| Power input | DC 12 V |
| Rated output current | 3 A |
| Output power | ≤ 18 W |
Operation & mechanical
| Overall dimensions (W × H × T) | 335.0 × 275.0 × 70.4 mm |
|---|---|
| Operating temperature | 0°C ~ 50°C |
| Storage temperature | −20°C ~ 70°C |
| Relative humidity | 10% ~ 90% RH (non-condensing) |
| Housing | Aluminum |
| VESA / panel mounting | 80 × 80 |
| Warranty | 1 year |
Outline & drawing
Envelope and drill pattern follow the dimensional drawing: VESA 80 × 80 with 4× M4 pilot holes per drawing. Typical front panel depth about 20 mm; overall depth 45 mm. Use the drawing below for tolerances, cutouts, and production approval.
Envelope
335.0 × 275.0 × 70.4 mm
Active + mounting
Active: 293.76 × 165.24 mm · VESA 80 × 80
