13.3″ Android panel PC
13.3″ Android Industrial Panel PC
Fanless industrial all-in-one from KoreTouch’s Android series: RK3568 quad-core SoC, Android 11, FHD 1920 × 1080 PCAP display, IP65 front / IP40 rear, aluminum housing, and VESA 100 × 100 mounting. Standard 2 GB + 32 GB configuration with rich field I/O.
- 400 cd/m² typical brightness; upgrade path to 1,500 nits per datasheet.
- Operating −20 °C ~ 70 °C; storage −20 °C ~ 70 °C.
- HDMI, dual RJ45, USB 3.0, RS232/RS485, SIM slot; DC 12 V (≤ 28 W).
Highlights
- Industrial-grade LCD, continuous 24/7 operation
- Durable mechanical design for harsh environments
- PCAP: wet touch & glove touch
- Optical bonding (Wacker AB adhesive) — custom option
- AR / AF / AG surface treatment; Mohs 7; brightness up to 1,500 nits optional
- Wide-temperature design, high reliability
- IP65 front (IP40 back per datasheet feature list) — align sealing with your install
Typical applications
- Factory HMI, MES terminals, and production dashboards
- Self-service kiosk and smart retail POS fronts
- Warehouse, logistics, and field data-capture stations
- Edge gateways with serial, LAN, and wireless connectivity (contact sales)
Specifications
Values below match koretouch-sti-133ctpcw-android-specifications.pdf (same edition as the downloadable file in Documents). *Additional custom specifications available on request.
LCD panel
| Screen size | 13.3″ |
|---|---|
| IP rating | IP65 (front) / IP40 (back) |
| Active area (H × V) | 294.1 mm × 165.7 mm |
| Pixel pitch | 0.15285 mm × 0.15285 mm (166 PPI) |
| Resolution | 1920 (RGB) × 1080 FHD, 16:9 |
| Color | 16.7M |
| Brightness | 400 cd/m² |
| Contrast ratio | 1000:1 (typ., TM) |
| Response time (Tr+Tf, typ.) | 25 ms |
| Viewing angles (CR=10, typ.) | 89° / 89° / 89° / 89° |
| Backlight / lifetime | WLED / 50,000 h |
Touch panel
| Touch screen | PCAP multi-touch (10 points) |
|---|---|
| Touch interface | USB |
| Touch accuracy | ±2 mm |
| Tempered glass | Yes (AG / AF / AR optional) |
| Glass thickness | 2 mm |
PC system
| Motherboard | Industrial mainboard |
|---|---|
| CPU | RK3568 quad-core ARM Cortex-A55, up to 2.0 GHz |
| GPU / audio | Integrated graphics / integrated audio |
| Memory | DDR4 2 GB (standard) |
| Storage | eMMC 32 GB (standard) |
| Network | 1000 Mbit Ethernet, Wi-Fi, Bluetooth 5.2 |
| Operating system | Android 11 |
External connectors
| I/O (per datasheet) | 1× DC input · 1× Wi-Fi antenna · 2× COM RS232 · 2× COM RS485 · 1× HDMI · 2× USB 3.0 (1× OTG) · 2× RJ45 · 1× SIM · 1× audio I/O · 1× socket terminal |
|---|---|
| Accessories in package | Installation hook, power supply |
Power
| Power supply | External power adapter |
|---|---|
| Power input | DC 12 V |
| Rated output current | 5 A |
| Output power | ≤ 28 W |
Operation & mechanical
| Overall dimensions (W × H × T) | 320.3 × 204.0 × 45 mm |
|---|---|
| Operating temperature | −20°C ~ 70°C |
| Storage temperature | −20°C ~ 70°C |
| Relative humidity | 10% ~ 90% RH (non-condensing) |
| Housing | Aluminum |
| VESA / panel mounting | 100 × 100 |
| Warranty | 1 year |
Outline & drawing
Envelope and drill pattern follow the dimensional drawing: VESA 100 × 100 with 4× M4 pilot holes per drawing. Typical front panel depth about 20 mm; overall depth 45 mm. Use the drawing below for tolerances, cutouts, and production approval.
Envelope
320.3 × 204.0 × 45 mm
Active + mounting
Active: 294.1 × 165.7 mm · VESA 100 × 100 (4×M4)
